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Touch Screen BGA Rework Station 3 Heating Zones Manual For Electronic Assembly

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Touch Screen BGA Rework Station 3 Heating Zones Manual For Electronic Assembly

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Brand Name : HSTECH

Model Number : HS-520

Certification : CE

Place of Origin : China

MOQ : 1 set

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 100 sets per month

Delivery Time : 7~9 work days

Packaging Details : Wooden package

Product Name : BGA Rework Station

Warranty : 1 Year

Control : Touch Screen

Thickness : 0.3 - 5mm

Signal : SMEMA

Application : Electronic Assembly

Control System : PLC

Power Supply : AC220V

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Touch Screen BGA Rework Station 3 Heating Zones Manual For Electronic Assembly

Products Description

BGA Rework Station:

Purpose:
BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs).
BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework.


Key Components:
Precision Heating System: Typically uses infrared (IR) or hot air to selectively heat the BGA component for safe removal and installation.
Component Removal and Placement Tools: Utilize vacuum nozzles or other specialized tools to gently lift and position the BGA component.
Alignment and Vision Systems: Ensure precise alignment of the BGA component during placement, often with the help of cameras and software.
Rework Platforms: Provide a secure and temperature-controlled environment for the rework process.


Rework Process:
Preparation: The PCB is secured on the rework platform, and the area around the target BGA component is prepared for rework.
Heating: The heating system is used to gradually heat the BGA component, melting the solder balls and allowing the component to be removed.
Removal: The component is carefully lifted off the PCB using specialized tools, without damaging the underlying pads or traces.
Cleaning: The PCB pads are cleaned to remove any residual solder or flux, ensuring a clean surface for the new component.
New Component Placement: The replacement BGA component is precisely aligned and placed on the PCB, then reflowed using the heating system.


Advanced Features:
Automated Rework Routines: Some BGA rework stations offer pre-programmed rework sequences for specific component types, simplifying the process.
Integrated Camera and Software: Advanced systems use machine vision and software to assist with component alignment and placement.
Temperature Profiling: Ability to monitor and control the temperature profile during the rework process, ensuring proper solder reflow.


Applications:
Electronics Repair and Rework: Replacing faulty or damaged BGA components on PCBs, such as those found in consumer electronics, industrial equipment, and aerospace/defense systems.
Prototype Modifications: Allowing engineers to quickly and accurately rework BGA components during the product development phase.
Production Support: Enabling the rework of BGA components during small-scale or batch production runs.

Features:

1.Repair Success Rate:More Than 99%

2.Using The Industrial Touch Screen

3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)

4.With CE Certification.

​Specification:

Manual BGA Rework Station Model:HS-520
Power Supply AC 220V±10% 50/60Hz
Total power 3800W
Overall dimension L460mm*W480mm*H500mm
PCB size Max 300mm*280mm Min 10mm*10mm
BGA size Max 60mm*60mm Min 1mm*1mm
PCB thickness 0.3-5mm
Weight of machine 20KG
Warranty 3 years (1st year is free)
Usage Repair chips / phone motherboard etc

Packing & Delivery
Item
BGA Rework Station
Package
1 set into one wooden carton as safety condition
External Dimension
460*480*500mm
Weight
about 20kgs
Delivery
about 15-20 working days
Payment
D/P, T/T, Western Union, MoneyGram
Port
Shenzhen
Shipment
A.By Courier: 4-7 Working days by special offer
B.By Air: 7 Working days at appointed airport
C.By Sea: 20-25 Working days at appointed port

Touch Screen BGA Rework Station 3 Heating Zones Manual For Electronic Assembly

Touch Screen BGA Rework Station 3 Heating Zones Manual For Electronic Assembly


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