In PCB manufacturing, to improve production efficiency and facilitate assembly, multiple identical small circuit boards are often assembled into a single large board for production and placement. After all these steps are completed, they need to be cleanly and non-destructively separated. This process is called depaneling, and the machine that performs this process is a PCB separator.
1. Power supply: single-phase AC220V 50-60HZ.
2. Weight: 60KG.
3. Machine size: 770mm (length) * 370mm (width) * 420mm (height).
4. Cutting speed: 300mm/s.
5. Maximum stroke of the knife wheel: 350mm.
6. Fine adjustment of the knife wheel: 0-3mm.
7. The lower knife can be adjusted: 0-2mm.
8. The width of the rear baffle is: 150mm, the maximum PC board cutting width: 150mm, the maximum PC board cutting length: 350mm, the thickness of the PC board that can be cut: 0.6-3.2mm, the thickness between the V grooves: 0.25-2.0mm.
9. The infrared radiation switch is used for safety protection. When the hand or foreign object is in the knife movement area, the machine stops working to ensure safe operation.
10. The machine is driven by a stepper motor, which can be self-locked and precisely cut and positioned when powered on. It solves the problem that the travel point of DC and AC motors changes after working for a period of time due to inertia.
11. After connecting multiple PC boards with solder, breaking often damages the circuit or breaks the electronic parts. Using this machine can avoid damage and improve work efficiency and quality.
12. The above circular knife walking and cutting can completely reduce stress, prevent solder joints from cracking and parts from breaking.
13. The upper circular knife and lower flat knife method is adopted. The PC board is placed on the lower flat knife. Once the switch is stepped on, the upper circular knife moves horizontally to the set fixed point, and the PC board is cut and divided. The cutting does not fall off and the incision is smooth.
14. The upper and lower knives are imported high-speed steel, the knives are durable, and when the knives are not sharp, they can be re-grinded, about 2 times.
Scoring Depaneler
Principle: A high-speed rotating milling cutter cuts along pre-designed V-grooves (V-cuts) in the board.
Advantages: Fast, relatively low cost, suitable for depaneling simple shapes and straight lines.
Disadvantages: Generates stress dust and places stress on the board edges, making it unsuitable for very fragile or high-density boards.
Routing Depaneler
Principle: Similar to a CNC machine tool, a high-speed spindle drives the milling cutter, precisely cutting along a programmed path.
Advantages: Minimal stress, capable of cutting any shape (curved or irregularly shaped), with high precision and smooth, clean edges.
Disadvantages: Slower than the Scoring Depaneler, with higher equipment and maintenance costs.
Applications: Widely used in applications requiring high reliability, such as mobile phones, automotive electronics, and aerospace.
Laser Depaneler
Principle: Uses a high-energy laser beam to melt the material, achieving contactless cutting.
Advantages: Completely stress-free, extremely high precision, narrow kerf, dust-free, and capable of processing very delicate flexible printed circuits (FPCs).
Disadvantages: High equipment cost, relatively slow cutting speed, and complex parameter adjustments for different materials (such as copper and FR4).
